VOXMICRO Announces Configurable Qualcomm Dragonwing NPro 7 Wi-Fi 7 Module-System at Xponential 2026

Wi-Fi 7 modular system on Qualcomm NPro 7 (QCN927x) + WAVIA configurable architecture. Module-down (LGA) as an alternative to chip-down; slotted also available.

DETROIT, MI, UNITED STATES, May 13, 2026 /EINPresswire.com/ -- VOXMICRO today announced the AIRETOS^® E92 Class, a Wi-Fi 7 wireless module family powered by the Qualcomm^® QCN9274 / QCN6274 Dragonwing™ NPro 7 Platform and built on VOXMICRO's patent-pending WAVIA™ architecture. The announcement is made during Xponential 2026 in Detroit (May 11–14), where VOXMICRO is meeting with system integrators, and OEMs targeting uncrewed-systems, robotics, and embedded-wireless applications.

The Qualcomm Dragonwing NPro 7 is a Wi-Fi 7 platform for enterprise, industrial, and infrastructure wireless. Headline performance of the E92 modules includes 11.5 Gbps peak dual-radio PHY rate, 320 MHz channel bandwidth in 6 GHz, 4×4 single-band or 2×2 + 2×2 dual-band configurations, up to 256 concurrent clients per radio, and IEEE 802.11be Multi-Link Operation (MLO). Single-band, dual-band diplexed, dual-independent-radio, and 4×4 single-radio modes are all supported on the same modular system foundation.

The Qualcomm Dragonwing NPro 7 Platform is engineered for high-performance Wi-Fi 7 with broad chain-count flexibility, multi-band capability, and infrastructure-grade radio capability built into the silicon. WAVIA extends that capability at the module level. Where each NPro 7 silicon implementation variation traditionally translates to a separate fixed-stack module SKU, the E92 captures the configuration freedom of the underlying silicon and exposes it as a parameter space at the module level. The result is a Wi-Fi 7 modular-system that retains Qualcomm's silicon-grade flexibility instead of locking it down.

The primary AIRETOS E92 form factor is module-down LGA (surface-mount on the host PCB) in Core-only or Core + Radio Extension Board configurations. Module-down LGA opens applications that off-the-shelf slotted modules cannot serve — thin, dense, integrated systems where the wireless function has to fit inside the host design rather than alongside it: robotics on NVIDIA^® Jetson™, NXP^® i.MX^®, and x86 hosts; AGV / AMR platforms; drones and UAVs; AR / VR and wearables; defense uncrewed systems; and portable medical and industrial-grade IoT. Module-down LGA gives the system designer direct control over RF routing into the host PCB, ESD strategy at the host level, and antenna placement and isolation — the host's own ground plane and stackup work with the module rather than against it. Slotted form factors — M.2 E-key, M.2 B-key, and mPCIe — are also available on the same architecture for enterprise access points, industrial gateways, high-density venues, and carrier-grade infrastructure where chassis mounting and field-swap matter.

Where the conventional Wi-Fi 7 module catalog asks customers to select among fixed-stack SKUs — one design per band plan, one per chain count, one per host PCB — the AIRETOS E92 supports a configuration space on a single architectural foundation. Band, power, and chain-count variants move by configuration selection rather than by module redesign or host re-layout. The same architectural foundation carries through subsequent AIRETOS infrastructure classes, giving customers a multi-generation Wi-Fi design-in architecture path that provides flexibility and application specificity.

AIRETOS E92 availability, evaluation kits, and reference design access will be announced separately.

About AIRETOS
AIRETOS^® is the wireless module brand of VOXMICRO. AIRETOS modules are engineered for industrial, robotic, mobility, and infrastructure systems requiring long-cycle product support and engineering rigor. Within the AIRETOS portfolio, infrastructure-class modules — those integrating multiple baseband radios per silicon — are built on the WAVIA architecture, starting with the E92 Class. Learn more at airetos.voxmicro.com.

About WAVIA
WAVIA is the architecture mark for VOXMICRO's configurable multi-radio RF module architecture, a patent-pending hardware foundation built on engineered substrate signal routing and distributed front-end topology. WAVIA is intended for licensing across product generations and third-party module manufacturers. Learn more at wavia.tech.

About the Qualcomm Dragonwing NPro 7 Wi-Fi 7 Platform
The AIRETOS E92 is powered by the Qualcomm^® QCN9274 and QCN6274 chipsets from the Qualcomm Dragonwing™ NPro 7 Platform — Qualcomm's Wi-Fi 7 platform engineered for enterprise, industrial, and infrastructure wireless. The NPro 7 Platform delivers IEEE 802.11be (Wi-Fi 7) performance with 320 MHz channel bandwidth in the 6 GHz band, Multi-Link Operation (MLO), and multi-radio configurations targeting access points, gateways, and high-density wireless infrastructure. Qualcomm and Qualcomm Dragonwing are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

About VOXMICRO
VOXMICRO is an embedded wireless RF technology company operating the AIRETOS^® module brand and the OxfordTEC^® antenna brand. VOXMICRO designs and manufactures wireless components, holds patent-pending architecture IP, and runs a licensing program for module manufacturers. Headquartered in Diamond Bar, California. Learn more at voxmicro.com.

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